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LOW NOISE PHEMT MMIC * FEATURES 9 GHz to 14 GHz Frequency Band 2.2 dB Noise Figure 25.5 dB Gain 19 dBm Output Power at Saturation +6 V Single Bias Supply
LMA246
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DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA246 is a high gain low noise PHEMT amplifier that operates from 9 to 14GHz. Reactively matched 3-stage amplifier provides 28dB nominal gain with 2dB typical noise figure and 1-dB gain compression power output of +17dBm that can be used as a pre-driver amplifier for phased array radar as well as commercial communications applications. Ground is provided to the circuitry through vias to the backside metallization.
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ELECTRICAL SPECIFICATIONS @ TAmbient = 25C
(VDD = +6.0V, ZIN = ZOUT = 50) Parameter Frequency Band Small Signal Gain Saturated Drain Current Small Signal Gain Flatness Noise Figure Power at 1-dB Compression Power at Saturation Input Return Loss Output Return Loss Reverse Isolation Symbol F S21 IDSS S21 NF P-1dB PSAT S11 S22 S12 50% IDSS RS = 12/12/3 at 60% IDSS 19 -14 -12 -60 RS = 12/12/5 at 50% IDSS RS = 0/0/0 Test Conditions Min 9 24 120 25.5 260 0.5 2.2 17 360 1.0 3.0 Typ Max 14 Units GHz dB mA dB dB dBm dBm dB dB dB
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 12/05/00 Email: sales@filss.com
LOW NOISE PHEMT MMIC * ABSOLUTE MAXIMUM RATINGS
Parameter Drain Voltage Operating Current RF Input Power Total Power Dissipation Channel Operating Temperature Storage Temperature Maximum Assembly Temperature (1 min. max.) Notes: * * * Symbol VD IOP PIN PTOT TCH TSTG TMAX Test Conditions TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C -- -- -65 Min Max 7 360 15 2.5 150 165 300 Units V mA dBm W C C C
LMA246
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Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. Recommended Continuous Operating Limits should be observed for reliable device operation. Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 12/05/00 Email: sales@filss.com
LOW NOISE PHEMT MMIC * ASSEMBLY DRAWING
LMA246
Notes: * * * *
Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290C. Maximum time at temperature is 1 minute. Use of forming gas (90% N2 , 10% H2 ) for best results. Bond on bond or stitch bond acceptable. Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 12/05/00 Email: sales@filss.com
LOW NOISE PHEMT MMIC * MECHANICAL OUTLINE
LMA246
Notes: * * * *
All units are in microns (m). All bond pads are 100 X 100 m 2 . Bias pad (VDD ) size is 100 X 121.5 m 2 . Unless otherwise specified.
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HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
All information and specifications are subject to change without notice.
Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: sales@filss.com

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